BE Semiconductor Industries is a key player in die-attach and packaging equipment, critical for advanced chip manufacturing. BESIY benefits from AI-driven chip demand and leads in advanced die attach ...

Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging technologies is ...

AI chips required by generative AI rely on finely wired and processed equipment; thus, front-end process equipment manufacturers have shifted their focus to the advanced packaging solutions market as ...

Global sales of equipment for semiconductor manufacturing by original equipment manufacturers (OEMs) is forecast to reach a ...

Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027.

Dutch chip gear maker ASML has lifted the kimono its Twinscan XT:260, a new lithography scanner built for the brave new world of 3D chip packaging. The outfit claims that it is the first machine of ...

The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies.

We recently published 13 Best Semiconductor Equipment Stocks to Buy According to Hedge Funds. ACM Research, Inc. (NASDAQ:ACMR) is one of the stocks Jim Cramer recently discussed. ACM Research, Inc.

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

Xanadu, the Canadian photonic quantum computing firm, has teamed up with semiconductor equipment manufacturer Disco to develop next-generation wafer processing techniques for ultra-low-loss photonic ...