In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...
The National Academies of Sciences, Engineering, and Medicine are private, nonprofit institutions that provide expert advice on some of the most pressing challenges facing the nation and world. Our ...
The production of high-quality three-dimensional assets has long been constrained by the technical expertise and time investment required to create professional-grade models. Hyper3D, the flagship ...
A new technical paper titled “MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures” was published by researchers at University of Wisconsin–Madison, Washington State ...
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