SECO has launched the SOM-COMe-BT6-PTL, a new COM Express Type 6 module powered by new Intel Core Ultra Series 3 processors, which have just launched at CES in Las Vegas. The module provides customers ...
Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...
The Hackett Group, Inc. (NASDAQ: HCKT), a leading Gen AI consultancy and enterprise digital transformation firm, today announced the launch of Hackett AI XPLR™ 5.0, which supports enterprise AI ...
SK hynix showcases its next-gen memory solutions for AI at CES 2026: with 48GB HBM4, SOCAMM, LPDDR6, and more for future AI ...
AAEON BOXER-8742AI is a fanless Edge AI embedded system powered by an NVIDIA Jetson T4000 that was unveiled along with the ...
Vietnam Investment Review on MSN
Geely Redefines Next-Gen Smart Vehicle Tech, Unveiling Full-Domain AI 2.0 and G-ASD at CES 2026
Geely Auto Group attended the Consumer Electronics Show (CES) 2026 for the third consecutive year, reinforcing its commitment ...
Press Trust of India on MSN
Innodisk Unveils the New 'AI on Dragonwing' Computing Series with the First EXMP-Q911 COM-HPC Mini Module Powered by Qualcomm's SoC
Innodisk, a leading global AI solution provider, announced the launch of its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc[1]. The flagship ...
ROI appears to be on track, with four out of five seeing their gen AI investments paying off within three years.
Artificial intelligence is completely changing the way we go about our daily lives. Examples abound: Google Gemini’s diagnosis for your cold, your iPhone’s AI-powered photo editing, or ChatGPT’s ...
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