MUNICH--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today introduced the Cadence ® Legato™ Reliability Solution, the industry’s first software product that meets the challenges of ...

Chip reliability is coming under much tighter scrutiny as IC-driven systems take on increasingly critical and complex roles. So whether it’s a stray alpha particle that flips a memory bit, or some ...

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management, how it’s expanding and changing, and where the problems are, with Prashant Goteti, principal ...

As IC electronics have become more densely packed, cross-talk among them has become a problem As IC electronics have become more densely packed, cross-talk among them has become a problem. One means ...

The move to environmentally sound RoHS-compliant products poses a number of significant challenges to the electronics industry. One of the most important is the move to higher solder process ...

Power Integrations’ 1700 V Switcher IC Delivers Reliability and Space-Saving Benefits in 800 V BEVs Performance of InnoSwitch™3-AQ flyback IC demonstrated in new reference designs featuring ...

FormFactor (www.formfactor.com) has introduced a test platform for automotive devices that can reduce wire bond or system-on-chip device pad pitch as low as 60µm, increase the number of die tested in ...

STAr Technologies, a leader in parametric and reliability test systems today has launched STAr Pluto series tester to meet test needs for both Package- and Wafer-level reliability test systems. This ...

Reliability tests are a crucial part of the manufacturing process, one that ensures your product meets the quality standards your customers expect. All the same, designing good reliability tests is ...

Performance of InnoSwitch™3-AQ flyback IC demonstrated in new reference designs featuring wide-creepage package The InnoSwitch3-AQ IC, featuring a 1700 V silicon-carbide (SiC) switch, is an ideal ...