Business Wire

OIF Launches the Industry’s First Co-Packaging Standard – the 3.2T Co-Packaged Module Implementation Agreement

FREMONT, Calif.--(BUSINESS WIRE)--OIF, celebrating 25 years of getting the optical networking industry’s interoperability work done, continues to be at the forefront of the industry, promoting ...
Nasdaq

Tower Semiconductor and Innolight Collaborate on Breakthrough Silicon Photonics Technology to Enhance Optical Module Production for AI and Data Centers

Tower Semiconductor and Innolight have announced an expanded collaboration focused on high-volume production of optical modules utilizing Tower's new Silicon Photonics (SiPho) technology. This ...
Electronic Design

3-nm Optical DSP Meets AI's Need for Speed in Data Centers

In data centers, pluggable optical transceivers are critical for managing the massive flow of data required by AI, converting electrical signals into photons, slinging them between server racks, and ...
Nasdaq

Marvell Extends 1.6T Connectivity Leadership With Industry's First PAM4 Optical DSP Integrating 200 Gbps Electrical and Optical Interfaces

SANTA CLARA, Calif., March 25, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Marvell® Nova 2, the industry's ...