The packaging industry enters 2026 under regulatory and sustainability pressures after a year of smart and bio-based ...

TAICHUNG, Taiwan (Reuters) - Nvidia's (NVDA) demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said ...

The patent pending packaging is made with a PE-based recyclable film designed to replace laminated, nonrecyclable structures used in snack packaging. ProAmpac's new ProActive Recyclable R-2200 ...

Automotive radar systems are typically composed of an antenna, front-end radar sensor and back-end signal processor. Current state-of-the-art automotive radar systems make use of the latest integrated ...

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as ...

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips ...

From August 2026, the European Union will begin enforcing a single set of packaging rules across all member states as the ...

The funding will upgrade processing and packaging technology, boosting halal-certified output and improving food safety and ...