For use in IoT chemical sensors that can diagnose diseases through breath tests Third-year doctoral student Toshiaki Takahashi, associate professor Kazuhiro Takahashi, and their research team from the ...
Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still ...
It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...
Semiconductor glass substrates are drawing attention as a key material that can solve problems in the packaging domain, which has hit technical limits in the age of artificial intelligence (AI). Major ...
TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...
An extremely ambitious startup called Substrate Inc. said today it has raised an initial $100 million to fund its mission to disrupt the global semiconductor industry and reinvent chipmaking. The ...
GOLETA, CA/ ACCESS Newswire/ April 23, 2025/ Aeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, ...
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New semiconductor etching process achieves five-fold speed improvement
After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...
A tightening supply of indium phosphide substrates is emerging as a bottleneck for artificial intelligence data centers and high-speed optical interconnects, prompting compound semiconductor supplier ...
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